Integrated memory mapped controller circuit for fiber optics transceiver

ABSTRACT

Circuitry for monitoring an optoelectronic device includes memory, including one or more memory arrays for storing information related to the optoelectronic device and analog to digital conversion circuitry for: receiving a plurality of analog signals from the optoelectronic device; converting the received analog signals into digital values; and storing the digital values in memory mapped locations within the memory. The analog signals correspond to operating conditions of the optoelectronic device. The circuitry further includes a memory interface for allowing a host device to read from and write to memory mapped locations within the memory in accordance with commands received from a host device. The memory interface allows the host device to read the digital values corresponding to operating conditions of the optoelectronic device from the memory mapped locations within the memory.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.10/657,554, filed Sep. 4, 2003, now U.S. Pat. No. 7,184,668, which is acontinuation of U.S. application Ser. No. 10/266,869, filed Oct. 8,2002, now U.S. Pat. No. 7,058,310, which is a continuation-in-part ofprior application Ser. No. 09/777,917, filed Feb. 5, 2001, now U.S. Pat.No. 7,079,775, all of which are hereby incorporated by reference intheir entireties.

FIELD OF THE INVENTION

The present invention relates generally to the field of fiber optictransceivers and particularly to circuits used to monitor and controlthese transceivers. More specifically, the present invention is used toidentify abnormal and potentially unsafe operating parameters and toreport these to a host coupled to the fiber optic transceiver and/orperform laser shutdown, as appropriate.

BACKGROUND OF THE INVENTION

The two most basic electronic circuits within a fiber optic transceiverare the laser driver circuit, which accepts high speed digital data andelectrically drives an LED or laser diode to create equivalent opticalpulses, and the receiver circuit which takes relatively small signalsfrom an optical detector and amplifies and limits them to create auniform amplitude digital electronic output. In addition to, andsometimes in conjunction with these basic functions, there are a numberof other tasks that must be handled by the transceiver circuitry as wellas a number of tasks that may optionally be handled by the transceivercircuit to improve its functionality. These tasks include, but are notnecessarily limited to, the following:

-   -   Setup functions. These generally relate to the required        adjustments made on a part-to-part basis in the factory to allow        for variations in component characteristics such as laser diode        threshold current.    -   Identification. This refers to general purpose memory, typically        EEPROM (electrically erasable and programmable read only memory)        or other nonvolatile memory. The memory is preferably accessible        using a serial communication bus in accordance with an industry        standard. The memory is used to store various information        identifying the transceiver type, capability, serial number, and        compatibility with various standards. While not standard, it        would be desirable to further store in this memory additional        information, such as sub-component revisions and factory test        data.    -   Eye safety and general fault detection. These functions are used        to identify abnormal and potentially unsafe operating parameters        and to report these to the user and/or perform laser shutdown,        as appropriate.    -   In addition, it would be desirable in many transceivers for the        control circuitry to perform some or all of the following        additional functions:    -   Temperature compensation functions. For example, compensating        for known temperature variations in key laser characteristics        such as slope efficiency.    -   Monitoring functions. Monitoring various parameters related to        the transceiver operating characteristics and environment.        Examples of parameters that it would be desirable to monitor        include laser bias current, laser output power, received power        level, supply voltage and temperature. Ideally, these parameters        should be monitored and reported to, or made available to, a        host device and thus to the user of the transceiver.    -   Power on time. It would be desirable for the transceiver's        control circuitry to keep track of the total number of hours the        transceiver has been in the power on state, and to report or        make this time value available to a host device.    -   Margining. “Margining” is a mechanism that allows the end user        to test the transceiver's performance at a known deviation from        ideal operating conditions, generally by scaling the control        signals used to drive the transceiver's active components.    -   Other digital signals. It would be desirable to enable a host        device to be able to configure the transceiver so as to make it        compatible with various requirements for the polarity and output        types of digital inputs and outputs. For instance, digital        inputs are used for transmitter disable and rate selection        functions while digital outputs are used to indicate transmitter        fault and loss of signal conditions.

Few if any of these additional functions are implemented in mosttransceivers, in part because of the cost of doing so. Some of thesefunctions have been implemented using discrete circuitry, for exampleusing a general purpose EEPROM for identification purposes, by inclusionof some functions within the laser driver or receiver circuitry (forexample some degree of temperature compensation in a laser drivercircuit) or with the use of a commercial micro-controller integratedcircuit. However, to date there have not been any transceivers thatprovide a uniform device architecture that will support all of thesefunctions, as well as additional functions not listed here, in a costeffective manner.

It is the purpose of the present invention to provide a general andflexible integrated circuit that accomplishes all (or any subset) of theabove functionality using a straightforward memory mapped architectureand a simple serial communication mechanism.

FIG. 1 shows a schematic representation of the essential features of atypical prior-art fiber optic transceiver. The main circuit 1 containsat a minimum transmit and receiver circuit paths and power supplyvoltage 19 and ground connections 18. The receiver circuit typicallyconsists of a Receiver Optical Subassembly (ROSA) 2 which contains amechanical fiber receptacle as well as a photodiode and pre-amplifier(preamp) circuit. The ROSA is in turn connected to a post-amplifier(postamp) integrated circuit 4, the function of which is to generate afixed output swing digital signal which is connected to outsidecircuitry via the RX+ and RX− pins 17. The postamp circuit also oftenprovides a digital output signal known as Signal Detect or Loss ofSignal indicating the presence or absence of suitably strong opticalinput. The Signal Detect output is provided as an output on pin 18. Thetransmit circuit will typically consist of a Transmitter OpticalSubassembly (TOSA), 3 and a laser driver integrated circuit 5. The TOSAcontains a mechanical fiber receptacle as well as a laser diode or LED.The laser driver circuit will typically provide AC drive and DC biascurrent to the laser. The signal inputs for the AC driver are obtainedfrom the TX+ and TX− pins 12. Typically, the laser driver circuitry willrequire individual factory setup of certain parameters such as the biascurrent (or output power) level and AC modulation drive to the laser.Typically this is accomplished by adjusting variable resistors orplacing factory selected resistors 7, 9 (i.e., having factory selectedresistance values). Additionally, temperature compensation of the biascurrent and modulation is often required. This function can beintegrated in the laser driver integrated circuit or accomplishedthrough the use of external temperature sensitive elements such asthermistors 6, 8.

In addition to the most basic functions described above, sometransceiver platform standards involve additional functionality.Examples of this are the external TX disable 13 and TX fault 14 pinsdescribed in the GBIC standard. In the GBIC standard, the external TXdisable pin allows the transmitter to be shut off by the host device,while the TX fault pin is an indicator to the host device of some faultcondition existing in the laser or associated laser driver circuit. Inaddition to this basic description, the GBIC standard includes a seriesof timing diagrams describing how these controls function and interactwith each other to implement reset operations and other actions. Some ofthis functionality is aimed at preventing non-eyesafe emission levelswhen a fault conditions exists in the laser circuit. These functions maybe integrated into the laser driver circuit itself or in an optionaladditional integrated circuit 11. Finally, the GBIC standard alsorequires the EEPROM 10 to store standardized serial ID information thatcan be read out via a serial interface (defined as using the serialinterface of the ATMEL AT24C01A family of EEPROM products) consisting ofa clock 15 and data 16 line.

Similar principles clearly apply to fiber optic transmitters orreceivers that only implement half of the full transceiver functions.

In addition, optical energy emitted from fiber optic transceivers ispotentially dangerous to the human eye. Of particular concern arelasers, because they emit monochromatic, coherent, and highly collimatedlight that concentrates energy into a narrow beam. It is the energydensity of this narrow beam that can harm biological tissues,particularly the eye.

The severity of harm to biological tissues depends on the amount ofenergy, the exposure time, and the wavelength of the light, where theeye is more sensitive to lower wavelengths. Furthermore, seeing thatmost light used in fiber-optic systems is infrared energy that cannot beseen, a victim might be exposed to such infrared energy without noticingit.

Therefore, to address eye-safety concerns, laser-based products areregulated by standards. In the United States, responsibility for theseregulations resides in the Center for Devices and Radiological Health(CDRH) of the Food and Drug Administration. Outside of the UnitedStates, the principle regulation is International ElectrotechnicalCommission (IEC) Publication 825. These regulations cover both thedevices themselves and products using them.

The CDRH and IEC regulations define four classes of devices as follows:

Class I: These devices are considered inherently safe. The IEC requiresa classification label, but the CDRH does not.

Class II: Class 2 lasers have levels similar to a Class I device for anexposure of 0.25 second. Eye protection is normally provided by what iscalled a “normal aversion response.” This means that a victim usuallyresponds to an exposure by an involuntary blink of the eye.

Class III: Both the CDRH and IEC define two subclasses: IIIa and IIIb.Class IIIa devices cannot injure a person's eye under normal conditionsof bright light. They can, however, injure eyes when viewed through anoptical aid such as a microscope or telescope. For Class IIIa, the CDRHconcerns only visible light, while the IEC includes all wavelengths.Class IIIb devices can injure the eye if the light is viewed directly.

Class IV: These devices are more powerful than even Class IIIb lasers.They can injure the eye even when viewed indirectly.

The abovementioned regulations use equations to determine acceptablepower levels at a given wavelength as well as procedures for makingmeasurements or estimating power levels. Most lasers in fiber optics areeither Class I or Class IIIb devices. Class I devices require no specialprecautions. Class IIIb devices, besides cautionary labels and warningsin the documentation, require that circuits be designed to lessen thelikelihood of accidental exposure. For example, a safety interlock isprovided so that the laser will not operate if exposure is possible.

One safety system is called open fiber control (OFC), which shuts downthe laser if the circuit between the transmitter and receiver is open. Atypical OFC system continuously monitors an optical link to ensure thatthe link is operating correctly by having the receiving circuit providefeedback to the transmitting circuit. If the receiving circuit does notreceive data, the transmitting circuit stops operating the laser, underthe assumption that a fault has occurred that might allow exposure todangerous optical levels. This system, however, requires additionalsensors and/or circuitry between the transmitter and the receiver. Thisis both costly and ineffective where the transmitter has not yet beencoupled to a receiver.

In light of the above it is highly desirable to provide a system andmethod for identifying abnormal and potentially unsafe operatingparameters of the fiber optic transceiver, to report these to the user,and/or perform laser shutdown, as appropriate.

SUMMARY OF THE INVENTION

The present invention is preferably implemented as a single-chipintegrated circuit, sometimes called a controller, for controlling atransceiver having a laser transmitter and a photodiode receiver. Thecontroller includes memory for storing information related to thetransceiver, and analog to digital conversion circuitry for receiving aplurality of analog signals from the laser transmitter and photodiodereceiver, converting the received analog signals into digital values,and storing the digital values in predefined locations within thememory. Comparison logic compares one or more of these digital valueswith predetermined setpoints, generates flag values based on thecomparisons, and stores the flag values in predefined locations withinthe memory. Control circuitry in the controller controls the operationof the laser transmitter in accordance with one or more values stored inthe memory. In particular, the control circuitry shuts off the lasertransmitter in response to comparisons of signals with predeterminedsetpoints that indicate potential eye safety hazards.

A serial interface is provided to enable a host device to read from andwrite to locations within the memory. A plurality of the controlfunctions and a plurality of the monitoring functions of the controllerare exercised by a host computer by accessing corresponding memorymapped locations within the controller.

In some embodiments the controller further includes a cumulative clockfor generating a time value corresponding to cumulative operation timeof the transceiver, wherein the generated time value is readable via theserial interface.

In some embodiments the controller further includes a power supplyvoltage sensor that measures a power supply voltage supplied to thetransceiver. In these embodiments the analog to digital conversioncircuitry is configured to convert the power level signal into a digitalpower level value and to store the digital power level value in apredefined power level location within the memory. Further, thecomparison logic of the controller may optionally include logic forcomparing the digital power supply voltage with a voltage level limitvalue, generating a flag value based on the comparison of the digitalpower supply voltage with the power level limit value, and storing apower level flag value in a predefined power level flag location withinthe memory.

In some embodiments the controller further includes a temperature sensorthat generates a temperature signal corresponding to a temperature ofthe transceiver. In these embodiments the analog to digital conversioncircuitry is configured to convert the temperature signal into a digitaltemperature value and to store the digital temperature value in apredefined temperature location within the memory. Further, thecomparison logic of the controller may optionally include logic forcomparing the digital temperature value with a temperature limit value,generating a flag value based on the comparison of the digitaltemperature signal with the temperature limit value, and storing atemperature flag value in a predefined temperature flag location withinthe memory.

In some embodiments the controller further includes “margining”circuitry for adjusting one or more control signals generated by thecontrol circuitry in accordance with an adjustment value stored in thememory.

BRIEF DESCRIPTION OF THE DRAWINGS

Additional objects and features of the invention will be more readilyapparent from the following detailed description and appended claimswhen taken in conjunction with the drawings, in which:

FIG. 1 is a block diagram of a prior art optoelectronic transceiver;

FIG. 2 is a block diagram of an optoelectronic transceiver in accordancewith the present invention;

FIG. 3 is a block diagram of modules within the controller of theoptoelectronic transceiver of FIG. 2;

FIG. 4 is a more detailed block diagram of the connections between thecontroller and the laser driver and post-amplifier;

FIG. 5A is a block diagram of a high-resolution alarm system and a fasttrip alarm system, for monitoring and controlling the operation of thefiber optic transceiver to ensure eye safety;

FIG. 5B is a block diagram of logic for disabling the operation of thefiber optic transceiver to ensure eye safety;

FIG. 6 is a flow chart of a method for reducing or preventingpotentially unsafe operation of a fiber optic transceiver using the fasttrip alarm system of FIG. 5A; and

FIG. 7 is a flow chart of a method for reducing or preventingpotentially unsafe operation of a fiber optic transceiver using thehigh-resolution alarm system of FIG. 5A.

Like reference numerals refer to corresponding parts throughout theseveral views of the drawings.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

A transceiver 100 based on the present invention is shown in FIGS. 2 and3. The transceiver 100 contains a Receiver Optical Subassembly (ROSA)102 and Transmitter Optical Subassembly (TOSA) 103 along with associatedpost-amplifier 104 and laser driver 105 integrated circuits thatcommunicate the high speed electrical signals to the outside world. Inthis case, however, all other control and setup functions areimplemented with a third single-chip integrated circuit 110 called thecontroller IC.

The controller IC 110 handles all low speed communications with the enduser. These include the standardized pin functions such as Loss ofSignal (LOS) 111, Transmitter Fault Indication (TX FAULT) 14, and theTransmitter Disable Input (TXDIS) 13. The controller IC 110 has a twowire serial interface 121, also called the memory interface, foraccessing memory mapped locations in the controller. Memory Map Tables1, 2, 3 and 4, below, are an exemplary memory map for one embodiment ofa transceiver controller, as implemented in one embodiment of thepresent invention. It is noted that Memory Map Tables 1, 2, 3 and 4, inaddition to showing a memory map of values and control featuresdescribed in this document, also show a number of parameters and controlmechanisms that are outside the scope of this document and thus are notpart of the present invention.

The interface 121 is coupled to host device interface input/outputlines, typically clock (SCL) and data (SDA) lines, 15 and 16. In thepreferred embodiment, the serial interface 121 operates in accordancewith the two wire serial interface standard that is also used in theGBIC and SFP standards, however other serial interfaces could equallywell be used in alternate embodiments. The two wire serial interface 121is used for all setup and querying of the controller IC 110, and enablesaccess to the optoelectronic transceiver's control circuitry as a memorymapped device. That is, tables and parameters are set up by writingvalues to predefined memory locations of one or more nonvolatile memorydevices 120, 122, 128 (e.g., EEPROM devices) in the controller, whereasdiagnostic and other output and status values are output by readingpredetermined memory locations of the same nonvolatile memory devices120, 122, 128. This technique is consistent with currently definedserial ID functionality of many transceivers where a two wire serialinterface is used to read out identification and capability data storedin EEPROM.

It is noted here that some of the memory locations in the memory devices120, 122, 128 are dual ported, or even triple ported in some instances.That is, while these memory mapped locations can be read and in somecases written via the serial interface 121, they are also directlyaccessed by other circuitry in the controller 110. For instance, certain“margining” values stored in memory 120 are read and used directly bylogic 134 to adjust (i.e., scale upwards or downwards) drive levelsignals being sent to the D/A output devices 123. Similarly, there areflags stored in memory 128 that are (A) written by logic circuit 131,and (B) read directly by logic circuit 133. An example of a memorymapped location not in memory devices but that is effectively dualported is the output or result register of clock 132. In this case theaccumulated time value in the register is readable via the serialinterface 121, but is written by circuitry in the clock circuit 132.

In addition to the result register of the clock 132, other memory mappedlocations in the controller may be implemented as registers at the inputor output of respective sub-circuits of the controller. For instance,the margining values used to control the operation of logic 134 may bestored in registers in or near logic 134 instead of being stored withinmemory device 128. In another example, measurement values generated bythe ADC 127 may be stored in registers. The memory interface 121 isconfigured to enable the memory interface to access each of theseregisters whenever the memory interface receives a command to access thedata stored at the corresponding predefined memory mapped location. Insuch embodiments, “locations within the memory” include memory mappedregisters throughout the controller.

In an alternate embodiment, the time value in the result register of theclock 132, or a value corresponding to that time value, is periodicallystored in a memory location with the memory 128 (e.g., this may be doneonce per minute, or once per hour of device operation). In thisalternate embodiment, the time value read by the host device viainterface 121 is the last time value stored into the memory 128, asopposed to the current time value in the result register of the clock132.

As shown in FIGS. 2 and 3, the controller IC 110 has connections to thelaser driver 105 and receiver components. These connections servemultiple functions. The controller IC has a multiplicity of D/Aconverters 123. In the preferred embodiment the D/A converters areimplemented as current sources, but in other embodiments the D/Aconverters may be implemented using voltage sources, and in yet otherembodiments the D/A converters may be implemented using digitalpotentiometers. In the preferred embodiment, the output signals of theD/A converters are used to control key parameters of the laser drivercircuit 105. In one embodiment, outputs of the D/A converters 123 areuse to directly control the laser bias current as well as to control thelevel of AC modulation to the laser (constant bias operation). Inanother embodiment, the outputs of the D/A converters 123 of thecontroller 110 control the level of average output power of the laserdriver 105 in addition to the AC modulation level (constant poweroperation).

In a preferred embodiment, the controller 110 includes mechanisms tocompensate for temperature dependent characteristics of the laser. Thisis implemented in the controller 110 through the use of temperaturelookup tables 122 that are used to assign values to the control outputsas a function of the temperature measured by a temperature sensor 125within the controller IC 110. In alternate embodiments, the controller110 may use D/A converters with voltage source outputs or may evenreplace one or more of the D/A converters 123 with digitalpotentiometers to control the characteristics of the laser driver 105.It should also be noted that while FIG. 2 refers to a system where thelaser driver 105 is specifically designed to accept inputs from thecontroller 110, it is possible to use the controller IC 110 with manyother laser driver ICs to control their output characteristics.

In addition to temperature dependent analog output controls, thecontroller IC may be equipped with a multiplicity of temperatureindependent (one memory set value) analog outputs. These temperatureindependent outputs serve numerous functions, but one particularlyinteresting application is as a fine adjustment to other settings of thelaser driver 105 or postamp 104 in order to compensate for processinduced variations in the characteristics of those devices. One exampleof this might be the output swing of the receiver postamp 104. Normallysuch a parameter would be fixed at design time to a desired valuethrough the use of a set resistor. It often turns out, however, thatnormal process variations associated with the fabrication of the postampintegrated circuit 104 induce undesirable variations in the resultingoutput swing with a fixed set resistor. Using the present invention, ananalog output of the controller IC 110, produced by an additional D/Aconverter 123, is used to adjust or compensate the output swing settingat manufacturing setup time on a part-by-part basis.

In addition to the connection from the controller to the laser driver105, FIG. 2 shows a number of connections from the laser driver 105 tothe controller IC 110, as well as similar connections from the ROSA 106and Postamp 104 to the controller IC 110. These are analog monitoringconnections that the controller IC 110 uses to provide diagnosticfeedback to the host device via memory mapped locations in thecontroller IC. The controller IC 110 in the preferred embodiment has amultiplicity of analog inputs. The analog input signals indicateoperating conditions of the transceiver and/or receiver circuitry. Theseanalog signals are scanned by a multiplexer 124 and converted using ananalog to digital converter (ADC) 127. The ADC 127 has 12 bit resolutionin the preferred embodiment, although ADC's with other resolution levelsmay be used in other embodiments. The converted values are stored inpredefined memory locations, for instance in the diagnostic value andflag storage device 128 shown in FIG. 3, and are accessible to the hostdevice via memory reads. These values are calibrated to standard units(such as millivolts or microwatts) as part of a factory calibrationprocedure.

The digitized quantities stored in memory mapped locations within thecontroller IC include, but are not limited to, the laser bias current,transmitted laser power, and received power (as measured by thephotodiode detector in the ROSA 102). In the memory map tables (e.g.,Table 1), the measured laser bias current is denoted as parameterB_(in), the measured transmitted laser power is denoted as P_(in), andthe measured received power is denoted as R_(in). The memory map tablesindicate the memory locations where, in an exemplary implementation,these measured values are stored, and also show where the correspondinglimit values, flag values, and configuration values (e.g., forindicating the polarity of the flags) are stored.

As shown in FIG. 3, the controller 110 includes a voltage supply sensor126. An analog voltage level signal generated by this sensor isconverted to a digital voltage level signal by the ADC 127, and thedigital voltage level signal is stored in memory 128. In a preferredembodiment, the A/D input multiplexer (mux) 124 and ADC 127 arecontrolled by a clock signal so as to automatically, periodicallyconvert the monitored signals into digital signals, and to store thosedigital values in memory 128.

Furthermore, as the digital values are generated, the value comparisonlogic 131 of the controller compares these values to predefined limitvalues. The limit values are preferably stored in memory 128 at thefactory, but the host device may overwrite the originally programmedlimit values with new limit values. Each monitored signal isautomatically compared with both a lower limit and upper limit value,resulting in the generation of two limit flag values that are thenstored in the diagnostic value and flag storage device 128. For anymonitored signals where there is no meaningful upper or lower limit, thecorresponding limit value can be set to a value that will never causethe corresponding flag to be set.

The limit flags are also sometimes call alarm and warning flags. Thehost device (or end user) can monitor these flags to determine whetherconditions exist that are likely to have caused a transceiver link tofail (alarm flags) or whether conditions exist which predict that afailure is likely to occur soon. Examples of such conditions might be alaser bias current which has fallen to zero, which is indicative of animmediate failure of the transmitter output, or a laser bias current ina constant power mode which exceeds its nominal value by more than 50%,which is an indication of a laser end-of-life condition. Thus, theautomatically generated limit flags are useful because they provide asimple pass-fail decision on the transceiver functionality based oninternally stored limit values.

In a preferred embodiment, fault control and logic circuit 133 logicallyOR's the alarm and warning flags, along with the internal LOS (loss ofsignal) input and Fault Input signals, to produce a binary Transceiverfault (TxFault) signal that is coupled to the host interface, and thusmade available to the host device. The host device can be programmed tomonitor the TxFault signal, and to respond to an assertion of theTxFault signal by automatically reading all the alarm and warning flagsin the transceiver, as well as the corresponding monitored signals, soas to determine the cause of the alarm or warning.

The fault control and logic circuit 133 furthermore conveys a loss ofsignal (LOS) signal received from the receiver circuit (ROSA, FIG. 2) tothe host interface.

Yet another function of the fault control and logic circuit 133 is todetermine the polarity of its input and output signals in accordancewith a set of configuration flags stored in memory 128. For instance,the Loss of Signal (LOS) output of circuit 133 may be either a logic lowor logic high signal, as determined by a corresponding configurationflag stored in memory 128.

Other configuration flags (see Table 4) stored in memory 128 are used todetermine the polarity of each of the warning and alarm flags. Yet otherconfiguration values stored in memory 128 are used to determine thescaling applied by the ADC 127 when converting each of the monitoredanalog signals into digital values.

In an alternate embodiment, another input to the controller 102, at thehost interface, is a rate selection signal. In FIG. 3 the rate selectionsignal is input to logic 133. This host generated signal would typicallybe a digital signal that specifies the expected data rate of data to bereceived by the receiver (ROSA 102). For instance, the rate selectionsignal might have two values, representing high and low data rates(e.g., 2.5 Gb/s and 1.25 Gb/s). The controller responds to the rateselection signal by generating control signals to set the analogreceiver circuitry to a bandwidth corresponding to the value specifiedby the rate selection signal.

Another function of the fault control and logic circuit 133 is todisable the operation of the transmitter (TOSA, FIG. 2) when needed toensure eye safety. There is a standards defined interaction between thestate of the laser driver and an internal Tx Disable output, which isimplemented by the fault control and logic circuit 133. When the logiccircuit 133 detects a problem that might result in an eye safety hazard,the laser driver is preferably disabled by activating an internal TxDisable signal output from the controller, as described in furtherdetail below. The host device can reset this condition by sending acommand signal on the external Tx Disable line 13 (FIG. 2) into thecontroller from the host. Further details of this functionality can befound below in relation to FIGS. 4-7.

FIG. 4 is a more detailed block diagram of the connections between thecontroller 110 (FIG. 2) and the laser driver 105 and post-amplifier 104.Optical signals received by the optical receiver in the ROSA 102 aretransmitted along a received power connection 402 to the postamp 104.The postamp 104 generates a fixed output swing digital signal which isconnected to the host, and/or controller 110 (FIG. 2), via RX+ and RX−connections 404. The postamp circuit preferably also provides a Loss ofSignal (LOS) indicator to the host, and/or controller 110 (FIG. 2), viaa LOS connection 406, indicating the presence or absence of suitablystrong optical input.

The host transmits signal inputs TX+ and TX− to the laser driver 105 viaTX+ and TX− connections 420. In addition, the controller 110 (FIG. 2)transmits power to the laser driver via connection 416, and atransmitter disable signal to the laser driver 105 via an internal TXdisable connection 418.

As a laser 410 within the TOSA is not turned on and off, but rathermodulated between high and low levels above a threshold current, amodulation current is supplied to the laser 410 via an AC modulationcurrent connection 414. Furthermore, a DC laser bias current is suppliedfrom the laser driver 105 to the laser 410 via a laser bias currentconnection 412. The level of the laser bias current is adjusted tomaintain proper laser output (i.e., to maintain a specified orpredefined average level of optical output power by the TOSA 103) and tocompensate for variations in temperature and power supply voltage.

In addition, some transceivers include an output power monitor 422within the TOSA 103 that monitors the energy output from the laser 410.The output power monitor 422 is preferably a photodiode within the laserpackage that measures light emitted from the back facet of the laser410. In general, the amount of optical power produced by the back facetof the laser diode, represented by an output power signal, is directlyproportional to the optical power output by the front or main facet ofthe laser 410. The ratio, K, of the back facet optical power to thefront facet optical power will vary from one laser diode to another,even among laser diodes of the same type. The output power signal istransmitted from the output power monitor 422 in the TOSA 103 to thecontroller 110 (FIG. 2) via a transmitter output power connection 408.

In a preferred embodiment, certain of the components within the fiberoptic transceiver include monitoring logic that outputs digital faultconditions. For example, the laser driver 105 may output a “out of lock”signal 424 if a control loop monitoring the modulation current isbroken. These digital fault condition outputs may then be used to notifythe host of fault conditions within the component, or shut down thelaser.

FIG. 5A is a block diagram 500 of a high-resolution alarm system 502 anda fast trip alarm system 504, for monitoring and controlling theoperation of the fiber optic transceiver to ensure eye safety. The fasttrip alarm system 504 is used to quickly generate flag used to shut downthe laser 410 (FIG. 4). The fast trip alarm system 504 uses an analogcomparator 522 to achieve a quick response. The high resolution alarmsystem 502 does not generate a flag to shut down the laser as quick asthe fast trip alarm system 504. However, the high resolution alarmsystem 502 is more accurate than the fast trip alarm system 504. Toachieve this accuracy, the high resolution alarm system 502 uses digitalcomparators 512. In use, the high resolution alarm system 502 and thefast trip alarm system 504 operate simultaneously. If the fast tripalarm system 504 does not generate a flag quickly, the high resolutionalarm system 502 will identify the fault and generate a flag to shutdown the laser.

The high-resolution alarm system 502 and fast trip alarm system 504 arepreferably contained within the controller 110 (FIG. 3). Both thehigh-resolution alarm system 502 and fast trip alarm system 504 arecoupled to an input signal 506. In a preferred embodiment this inputsignal is an analog signal. It should be noted that FIG. 5A shows thehigh-resolution alarm system 502 and fast trip alarm system 504 for asingle input signal 506. However, in a preferred embodiment, identicalalarm systems 502 and 504 are provided for each of several signals 506,including several different types of input signals.

The input signals processed by the alarm systems 502 and 504 preferablyinclude: power supply voltage, internal transceiver temperature(hereinafter “temperature”), laser bias current, transmitter outputpower, and received optical power. The power supply voltage 19 (FIG. 3)is preferably the voltage in millivolts as measured by the Vcc sensor126 (FIG. 3). The temperature is preferably the temperature in ° C. asmeasured by the temperature sensor 125 (FIG. 3). The laser bias currentis preferably the laser bias current in microamps supplied to the laser410 (FIG. 4) via the laser bias current connection 412 (FIG. 4). Thereceived optical power is the power in microwatts received at the ROSA102 (FIG. 4) via the received power connection 402 (FIG. 4). Finally,the optical output power (FIG. 4) is the optical power output inmicrowatts, from the power monitor 422 (FIG. 4) as received by thecontroller 110 (FIG. 2) via the output power connection 408 (FIG. 4).

The high-resolution alarm system 502 preferably utilizes all of theabove described input signals to trigger warnings and/or shut down atleast part of the fiber optic transceiver. In other embodiments thehigh-resolution alarm system 502 utilizes a subset of the abovedescribed input signals to trigger warnings and/or alarms. Thehigh-resolution alarm system 502 includes one or more analog to digitalconverters 124 (see also FIG. 3) that are configured to receive theanalog input signal 506. Each type of analog input signal is preferablyconverted to a digital input signal using a calibration factor 508 forthe particular type of input signal received. For example, a supplyvoltage in millivolts is converted to a 16 bit digital number bymultiplying a supply voltage millivolt value by a supply voltagecalibration factor. These calibration factors are predetermined and arepreferably stored in the diagnostic value and flag storage 128 (FIG. 3).Alternatively, such calibration factors 508 may be stored in the generalpurpose EEPROM 120 (FIG. 3).

The analog to digital converter 124 is also coupled to multiplecomparators 512. In a preferred embodiment, the comparators 512 form aportion of the value comparison and other logic 131 (FIG. 3) in thecontroller 110 (FIG. 2). In a preferred embodiment, these comparators512 are digital comparators.

Also coupled to the comparators 512 are high-resolution setpoints510(1)-(N). In a preferred embodiment, four predetermined setpoints510(1)-(4) (for each type of input signal 506) are stored in thediagnostic value and flag storage 128 (FIG. 3). These four predeterminedsetpoints are: a high alarm setpoint 510(1), a high warning setpoint510(2), a low warning setpoint 510(3), and a low alarm setpoint 510(4).The comparators 512(1)-(N) are configured to compare the input signal506 with the predetermined setpoints 510(1)-(4). In a preferredembodiment, the digital equivalent of the input signal 506 issimultaneously compared by the comparators 512(1)-(N), to each of thefour digital predetermined setpoints 510(1)-(N) for the particular typeof input signal received. Also in a preferred embodiment, the setpoints510(1)-(N) and the digital equivalents to the input signals 506 arepreferably sixteen bit numbers. Of course, in other embodiments theremay be more or fewer setpoints 510, and the setpoints 510 and inputsignal could be digitally represented by more or fewer than sixteenbits.

The comparators subsequently generate high-resolution flags 514(1)-(N),which are input into the general logic and fault control circuit 133(FIG. 3) to either provide a warning to the host computer, or to shutdown at least part of the fiber optic transceiver, such as the laserdriver 105 (FIG. 4) and/or laser 410 (FIG. 4). Further details of themethod for preventing potentially unsafe operation of the fiber optictransceiver, using the high-resolution alarm system 502, are describedbelow in relation to FIG. 7.

The fast trip alarm system 504 includes multiple temperature dependantsetpoints 516. These temperature dependant setpoints 516 are preferablystored in the diagnostic values flag storage 128 (FIG. 3) or the D/Atemperature lookup tables 122 (FIG. 3). A multiplexer 518 is configuredto supply one of the temperature dependant setpoints 516 to a digital toanalog converter 123 (also shown in FIG. 3). The precise temperaturedependant setpoint 516 that is supplied depends on the temperature 520measured by the temperature sensor 125 (FIG. 3). For example, for afirst measured temperature, a first setpoint is supplied by themultiplexer 518 to the digital to analog converter 123.

A separate copy or instance of the fast trip alarm system 504 isprovided for each input signal 506 for which a temperature based alarmcheck is performed. Unlike the high-resolution alarm system 502, thefast trip alarm system 504 preferably utilizes only the following inputsignals 506: laser bias current, transmitter output power, and receivedoptical power input signals, and thus in the preferred embodiment thereare three instances of the fast trip alarm system 504. In otherembodiment, fewer or more fast trip alarm systems 504 may be employed.The analog input signals processed by the fast trip alarm systems 504are each fed to a respective comparator 522 that compares the inputsignal to an analog equivalent of one of the temperature dependantsetpoints 516. In a preferred embodiment, the comparators 522 form aportion of the value comparison and other logic 131 (FIG. 3) in thecontroller 110 (FIG. 2). In a preferred embodiment, the comparators 522are analog comparators.

In a preferred embodiment at least eight temperature dependant setpoints516 are provided for the laser bias current input signal, with eachsetpoint corresponding to a distinct 16° C. temperature range. The sizeof the operating temperature range for each setpoint may be larger orsmaller in other embodiments. These temperature dependant setpoints forthe laser bias current are crucial because of the temperaturecompensation needs of a short wavelength module. In particular, at lowtemperatures the bias required to produce the required light output ismuch lower than at higher temperatures. In fact, a typical laser biascurrent when the fiber optic transceiver is at the high end of itstemperature operating range will be two or three times as high as thelaser bias current when fiber optic transceiver is at the low end of itstemperature operating range, and thus the setpoints vary dramaticallybased on operating temperature. A typical temperature operating range ofa fiber optic transceiver is about −40° C. to about 85° C. Thetemperature dependant setpoints for the laser bias current are alsocrucial because of the behavior of the laser bias circuit in a fiberoptic transceiver that transmits long wavelength energy.

Also in a preferred embodiment, at least four temperature dependantsetpoints 516 are provided for the received optical power andtransceiver output power input signals, with each setpoint correspondingto a distinct 32° C. operating temperature range of the fiber optictransceiver. The size of the operating temperature range for eachsetpoint may be larger or smaller in other embodiments.

In a preferred embodiment, the above mentioned setpoints 516 are 8 bitnumbers, which scale directly to the pin (Bin, Pin, Rin) input voltagesat (2.5V(max)/256 counts)=0.0098 volts/count.

The comparator 522 is configured to compare an analog equivalent of oneof the setpoints 516 to the analog input signal 506. In a preferredembodiment, if the analog input signal 506 is larger than the analogequivalent to one of the setpoints 516, then a fast trip alarm flag 524is generated. The fast trip alarm flag 524 is input into the generallogic and fault control circuit 133 (FIG. 3) to either provide a warningto the host computer or shut down at least part of the fiber optictransceiver, such as the laser driver 105 (FIG. 4) and/or laser 410(FIG. 4). Further details of the method for preventing potentiallyunsafe operation of the fiber optic transceiver, using the fast tripalarm system 504, are described below in relation to FIG. 6.

FIG. 5B is a block diagram of logic 530 for disabling the operation ofthe fiber optic transceiver to ensure eye safety, according to apreferred embodiment of the invention. The high-resolution alarm flags514(1)-(4), the fast trip alarm system flag 524, and any digital faultcondition 532 signals, from FIGS. 4 and 5A, are transmitted to an ORgate 534, which is used to shut down the laser. This is accomplished bysending a signal along the internal Tx disable line 418 (FIG. 4). Forexample if a digital “out of lock” signal or a fast trip alarm flag isreceived, the laser will be shut down. It should be appreciated thatmore or less alarm flags or digital fault condition signals may besupplied to the OR gate 534. For instance, in one preferred embodiment,the inputs to the OR gate 534 include only the high and low alarm flags514(1), 514(4), the fast trip alarm flag 524 and the digital faultcondition(s) signal 532. In other words, in this preferred embodiment,the warning flags 514(2) and 514(3) are not used to generate theinternal Tx disable signal 418.

FIG. 6 is a flow chart of a method 600 for reducing or preventingpotentially unsafe operation of a fiber optic transceiver using the fasttrip alarm system 504 of FIG. 5A. Once the fast trip alarm system 504(FIG. 5A) has started at step 602, an input signal is acquired, at step604. In a preferred embodiment, the input signal is preferably an analogsignal of: laser bias current in milliamps, received optical power inmicrowatts, or transceiver output power in microwatts. A temperature ofthe fiber optic transceiver is obtained at step 606. Step 606 may beperformed before, after or at the same time as input signal acquisitionstep 604.

The multiplexer 518 (FIG. 5A) uses the input signal and the measuredtemperature to determine, at step 608, which setpoint 516 (FIG. 5A) touse for comparison with the input signal. For example, if the inputsignal is laser bias current, then the multiplexer looks up a setpointfor laser bias current based on the obtained temperature 520 (FIG. 5A).

In a preferred embodiment, this setpoint is then converted from adigital to analog value, at step 610 by the digital to analog converter123 (FIG. 5A). Thereafter, the comparator 522 (FIG. 5A) compares theinput signal to the setpoint, at step 612, to determine whether there isa conflict, at step 614. In a preferred embodiment, a conflict occurswhere the input signal is higher than the setpoint (or an analogequivalent of the setpoint). Alternatively, a conflict may occur wherethe input signal is lower than the setpoint (or an analog equivalent ofthe setpoint).

If no conflict exists (614—No), then the method 600 repeats itself.However, if a conflict does exist (614—Yes), then a fast trip alarm flag524 (FIG. 5A) is generated at step 616. In a preferred embodiment thefast trip alarm flag 524 (FIG. 5A) is then used to shut down at leastpart of the fiber optic transceiver, at step 618, by applying a signalto the internal TxDisable connection 418 (FIG. 4). In a preferredembodiment the fast trip alarm flag 524 (FIG. 5A) is used to disable thelaser driver 105 (FIG. 4) and/or laser 410 (FIG. 4), so that nopotential eye-damage can occur.

The alarm flag 524 (FIG. 5A) can be used to control the laser driver viathe internal Tx Disable Output (Dout) and signal the fault to the hostsystem via the Tx Fault Output (Fout). These outputs can also respond tothe Tx Fault Input (Fin), if that signal exists in any givenimplementation, and the Tx Disable Input (Din) which comes into thefiber optic transceiver from the host.

FIG. 7 is a flow chart of a method 700 for reducing or preventingpotentially unsafe operation of a fiber optic transceiver using thehigh-resolution alarm system 502 of FIG. 5A. Once the high-resolutionalarm system 502 (FIG. 5A) has started at step 702, an input signal isacquired, at step 704. In a preferred embodiment, the input signal ispreferably an analog signal of: power supply voltage 19 (FIG. 3) inmillivolts; the temperature in ° C.; the laser bias current 412 (FIG. 4)in microamps; the received optical power 420 (FIG. 4) in microwatts; andthe output power 408 (FIG. 4) in microwatts. In other embodiments, theinput signal(s) may be scaled in accordance with other units.

An analog to digital converter 124 (FIGS. 3 and 5) then converts theanalog input signal 506 (FIG. 5A) to a digital equivalent, preferably a16 bit number, at step 706. Conversion of the analog input signal 506(FIG. 5A) to a digital equivalent performed includes multiplying theinput signal 506 (FIG. 5A) by a calibration factor 508 (FIG. 5A), atstep 708, for the particular type of input signal received, as describedabove in relation to FIG. 5A.

The comparators 512 (FIG. 5A) then compare the digital equivalent of theinput signal to the setpoints 510(1)-(N) (FIG. 5A), at step 710, todetermine whether there is a conflict. In a preferred embodiment,conflicts occur when the digital equivalent of the input signal is:higher than the high alarm setpoint 510(1) to produce a high-alarm flag514(1) (FIG. 5A); higher than the high warning setpoint 510(2) (FIG. 5A)to produce a high warning flag 514(2) (FIG. 5A); lower than a lowwarning flag 510(3) (FIG. 5A) to produce a low warning flag 514(3) (FIG.5A); or lower than a low alarm flag 510(4) (FIG. 5A) to produce a lowalarm flag 514(4) (FIG. 5A). It should, however, be appreciated thatother types of alarms or warnings may be set.

If no conflict exists (712—No), then the method 700 repeats itself.However, if a conflict does exist (714—Yes), then a high-resolution flag514(1)-(N) (FIG. 5A) is generated, at step 714. In a preferredembodiment, the high-resolution flags 514(1)-(N) (FIG. 5A) are a highalarm flag 514(1), a high warning flag 514(2), a low warning flag514(3), and a low alarm flag 514(4), as shown in FIG. 5A. Also in apreferred embodiment, the high alarm flag 514(1) (FIG. 5A) and the lowalarm flag 514(4) are used to shut down at least part of the fiber optictransceiver, at step 716, by applying a signal to the internal TxDisableconnection 418 (FIG. 4). The part of the fiber optic transceiver shutdown preferably includes the laser driver 105 (FIG. 4) and/or the TOSA103 (FIG. 4). The high and low warning flags 514(2) and 514(3) (FIG. 5A)preferably merely provide a warning to the host and do not shut down thelaser driver 105 (FIG. 4) and/or the TOSA 103 (FIG. 4).

The alarm flags 514(1)-(N) (FIG. 5A) can be used to control the laserdriver via the internal Tx Disable Output (Dout) and signal the fault tothe host system via the Tx Fault Output (Fout). These outputs can alsorespond to the Tx Fault Input (Fin), if that signal exists in any givenimplementation, and the Tx Disable Input (Din) which comes into thefiber optic transceiver from the host.

In a preferred embodiment, the high-resolution alarm system 502 (FIG.5A) updates the high-resolution alarm flags at a rate of approximatelyonce every 0.015 seconds (15 milliseconds), and more generally at least50 times per second. Thus, the high-resolution alarm flags are setwithin 0.015 seconds of the detection of an alarm condition. In someembodiments the high-resolution alarm flag update rate is between about50 times per second and 200 times per second. However, the fast tripalarm system 504 (FIG. 5A) preferably updates the fast trip alarm flagsa rate that is faster than once every 10 microseconds. In someembodiments the fast trip alarm system 504 updates the fast trip alarmflags at a rate that is between 50,000 and 200,000 times per second, andmore generally at least 50,000 times per second. In a preferredembodiment, the alarm flags of the fast trip alarm system 504 areupdated at a rate that is more than a thousand times faster than theupdate rate of the high-resolution alarm flags. In other embodiments thealarm flags of the fast trip alarm system 504 are updated at a rate thatis between 250 and 4000 times faster than the update rate of thehigh-resolution alarm flags.

To further aid the above explanation, two examples are presented below,where a single point failure causes an eye safety fault condition thatis detected, reported to a host coupled to the fiber optic transceiver,and/or a laser shutdown is performed.

EXAMPLE 1

The power monitor 422 (FIG. 4) in a fiber optic transceiver thatincludes a power monitor, or its associated circuitry, fails, indicatingno or low output power when the laser is in fact operating. The laserbias driver will attempt to increase the transmitter output power byincreasing laser bias current. Since the feedback is interrupted, thelaser is driven to its maximum capability, perhaps exceeding the eyesafety alarm setpoints. The fast trip alarm flag will be generated inless than 10 microseconds after the failure and this fast trip alarmflag can be used to shut down the laser driver via the internal Txdisable (Dout) output. If the fast trip alarm fails or is not selectedin the output logic setup, the high-resolution alarm for laser biascurrent is generated, and the high-resolution low alarm for power wouldalso occur, either of which could be used to shut down the laser driverand/or TOSA.

EXAMPLE 2

The laser driver (in all types of fiber optic transceiver), or itsassociated circuitry fails, driving the laser to its maximum output.Depending on the specific failure, the laser bias current may read zeroor very high, and in a fiber optic transceiver that includes a powermonitor, the power will read very high. The fast trip alarm for laserbias current, and the fast trip alarm for transmitted output power willgenerate an alarm flag within 10 microseconds. If the laser bias currentis reading zero, the high-resolution low alarm for laser bias currentwill generate an alarm flag. This may be indistinguishable from afailure that causes zero light output, like an open laser wire orshorted laser, but the alarm systems preferably err on the side ofsafety and command the laser to shut down. In this condition, it may notbe possible for the logic to physically turn the laser off, if, forexample, the fault was caused by a shorted bias driver transistor. Inany case, the link will be lost and the Tx fault output will be assertedto advise the host system of the failure. Depending on the configurationof the bias driver circuit, there are non-error conditions which couldset some of these flags during a host-commanded transmit disable state,or during startup conditions. For example, if the host commands atransmitter shutdown, some circuits might read zero transmit power, asone would expect, and some might read very large transmit power as anartifact of the shutdown mechanism. When the laser is re-enabled, ittakes a period of time for the control circuitry to stabilize, andduring this time there may be erratic occurrences of both low, high andfast trip alarms. Programmable delay timers are preferably used tosuppress the fault conditions during this time period.

While the combination of all of the above functions is desired in thepreferred embodiment of this transceiver controller, it should beobvious to one skilled in the art that a device which only implements asubset of these functions would also be of great use. Similarly, thepresent invention is also applicable to transmitters and receivers, andthus is not solely applicable to transceivers. Finally, it should bepointed out that the controller of the present invention is suitable forapplication in multichannel optical links.

TABLE 1 MEMORY MAP FOR TRANSCEIVER CONTROLLER Name of Location FunctionMemory Location (Array 0) 00h-5Fh IEEE Data This memory block is used tostore required GBIC data 60h Temperature MSB This byte contains the MSBof the 15-bit 2's complement temperature output from the temperaturesensor. 61h Temperature LSB This byte contains the LSB of the 15-bit 2'scomplement temperature output from the temperature sensor. (LSB is 0b).62h-63h V_(cc) Value These bytes contain the MSB (62h) and the LSB (63h)of the measured V_(cc) (15-bit number, with a 0b LSbit) 64h-65h B_(in)Value These bytes contain the MSB (64h) and the LSB (65h) of themeasured B_(in) (15-bit number, with a 0b LSbit) 66h-67h P_(in) ValueThese bytes contain the MSB (66h) and the LSB (67h) of the measuredP_(in) (15-bit number, with a 0b LSbit) 68h-69h R_(in) Value These bytescontain the MSB (68h) and the LSB (69h) of the measured R_(in) (15-bitnumber, with a 0b LSbit) 6Ah-6Dh Reserved Reserved 6Eh IO States Thisbyte shows the logical value of the I/O pins. 6Fh A/D Updated Allows theuser to verify if an update from the A/D has occurred to the 5 values:temperature, Vcc, B_(in), P_(in) and R_(in). The user writes the byte to00h. Once a conversion is complete for a give value, its bit will changeto ‘1’. 70h-73h Alarm Flags These bits reflect the state of the alarmsas a conversion updates. High alarm bits are ‘1’ if converted value isgreater than corresponding high limit. Low alarm bits are ‘1’ ifconverted value is less than corresponding low limit. Otherwise, bitsare 0b. 74h-77h Warning Flags These bits reflect the state of thewarnings as a conversion updates. High warning bits are ‘1’ if convertedvalue is greater than corresponding high limit. Low warning bits are ‘1’if converted value is less than corresponding low limit. Otherwise, bitsare 0b. 78h-7Ah Reserved Reserved 7Bh-7Eh Password Entry Bytes The fourbytes are used for password entry. PWE Byte 3 (7Bh) The entered passwordwill determine the MSByte user's read/write privileges. PWE Byte 2 (7Ch)PWE Byte 1 (7Dh) PWE Byte 0 (7Eh) LSByte 7Fh Array Select Writing tothis byte determines which of the upper pages of memory is selected forreading and writing. 0xh (Array x Selected) Where x = 1, 2, 3, 4 or 580h-F7h Customer EEPROM 87h DA % Adj Scale output of D/A converters byspecified percentage Memory Location (Array 1) 00h-FFh Data EEPROMMemory Location (Array 2) 00h-Ffh Data EEPROM Memory Location (Array 3)80h-81h Temperature High The value written to this location serves as88h-89h Alarm the high alarm limit. Data format is the 90h-91h Vcc HighAlarm same as the corresponding value 98h-99h B_(in) High Alarm(temperature, Vcc, B_(in), P_(in), R_(in)). A0h-A1h P_(in) High AlarmR_(in) High Alarm 82h-83h Temperature Low The value written to thislocation serves as 8Ah-8Bh Alarm the low alarm limit. Data format is thesame 92h-93h Vcc Low Alarm as the corresponding value (temperature,9Ah-9Bh B_(in) Low Alarm Vcc, B_(in), P_(in), R_(in)). A2h-A3h P_(in)Low Alarm R_(in) Low Alarm 84h-85h Temp High Warning The value writtento this location serves as 8Ch-8Dh Vcc High Warning the high warninglimit. Data format is the 94h-95h B_(in) High Warning same as thecorresponding value 9Ch-9Dh P_(in) High Warning (temperature, Vcc,B_(in), P_(in), R_(in)). A4h-A5h R_(in) High Warning 86h-87h TemperatureLow The value written to this location serves as 8Eh-8Fh Warning the lowwarning limit. Data format is the 96h-97h Vcc Low Warning same as thecorresponding value 9Eh-9Fh B_(in) Low Warning (temperature, Vcc,B_(in), P_(in), R_(in)). A6h-A7h P_(in) Low Warning R_(in) Low WarningA8h-AFh, D_(out) control 0-8 Individual bit locations are defined inTable C5h F_(out) control 0-8 4. B0h-B7h, C6h L_(out) control 0-8B8h-BFh, C7h C0h Reserved Reserved C1h Prescale Selects MCLK divisor forX-delay CLKS. C2h D_(out) Delay Selects number of prescale clocks C3hF_(out) Delay C4h L_(out) Delay C8h-C9h Vcc - A/D Scale 16 bits of gainadjustment for corresponding CAh-CBh B_(in) - A/D Scale A/D conversionvalues. CCh-CDh P_(in) - A/D Scale CEh-CFh R_(in) - A/D Scale D0h ChipAddress Selects chip address when external pin ASEL is low. D1h Margin#2 Finisar Selective Percentage (FSP) for D/A #2 D2h Margin #1 FinisarSelective Percentage (FSP) for D/A #1 D3h-D6h PW1 Byte 3 (D3h) The fourbytes are used for password 1 MSB entry. The entered password willdetermine PW1 Byte 2 (D4h) the Finisar customer's read/write privileges.PW1 Byte 1 (D5h) PW1 Byte 0 (D6h) LSB D7h D/A Control This bytedetermines if the D/A outputs source or sink current, and it allows forthe outputs to be scaled. D8h-DFh B_(in) Fast Trip These bytes definethe fast trip comparison over temperature. E0h-E3h P_(in) Fast TripThese bytes define the fast trip comparison over temperature. E4h-E7hR_(in) Fast Trip These bytes define the fast trip comparison overtemperature. E8h Configuration Override Location of the bits is definedin Table 4 Byte E9h Reserved Reserved EAh-EBh Internal State BytesLocation of the bits is defined in Table 4 ECh I/O States 1 Location ofthe bits is defined in Table 4 EDh-EEh D/A Out Magnitude of thetemperature compensated D/A outputs EFh Temperature Index Addresspointer to the look-up Arrays F0h-FFh Reserved Reserved Memory Location(Array 4) 00h-Ffh D/A Current vs. Temp #1 (User-Defined Look-up Array#1) Memory Location (Array 5) 00h-Ffh D/A Current vs. Temp #2(User-Defined Look-up Array #2)

TABLE 2 DETAIL MEMORY DESCRIPTIONS - A/D VALUES AND STATUS BITS Byte BitName Description Converted analog values. Calibrated 16 bit data. (SeeNotes 1-2)  96 All Temperature MSB Signed 2's complement integertemperature (60h) (−40 to +125 C.) Based on internal temperaturemeasurement  97 All Temperature LSB Fractional part of temperature(count/256)  98 All Vcc MSB Internally measured supply voltage intransceiver. Actual voltage is full 16 bit value * 100 uVolt.  99 AllVcc LSB (Yields range of 0-6.55 V) 100 All TX Bias MSB Measured TX BiasCurrent in mA Bias current is full 16 bit value * (1/256) mA. 101 All TXBias LSB (Full range of 0-256 mA possible with 4 uA resolution) 102 AllTX Power MSB Measured TX output power in mW. Output is full 16 bitvalue * (1/2048) mW. (see note 5) 103 All TX Power LSB (Full range of0-32 mW possible with 0.5 μW resolution, or −33 to +15 dBm) 104 All RXPower MSB Measured RX input power in mW RX power is full 16 bit value *(1/16384) mW. (see note 6) 105 All RX Power LSB (Full range of 0-4 mWpossible with 0.06 μW resolution, or −42 to +6 dBm) 106 All Reserved MSBReserved for 1^(st) future definition of digitized analog input 107 AllReserved LSB Reserved for 1^(st) future definition of digitized analoginput 108 All Reserved MSB Reserved for 2^(nd) future definition ofdigitized analog input 109 All Reserved LSB Reserved for 2^(nd) futuredefinition of digitized analog input 110 7 TX Disable Digital state ofthe TX Disable Input Pin 110 6 Reserved 110 5 Reserved 110 4 Rate SelectDigital state of the SFP Rate Select Input Pin 110 3 Reserved 110 2 TXFault Digital state of the TX Fault Output Pin 110 1 LOS Digital stateof the LOS Output Pin 110 0 Power-On-Logic Indicates transceiver hasachieved power up and data valid 111 7 Temp A/D Valid Indicates A/Dvalue in Bytes 96/97 is valid 111 6 Vcc A/D Valid Indicates A/D value inBytes 98/99 is valid 111 5 TX Bias A/D Valid Indicates A/D value inBytes 100/101 is valid 111 4 TX Power A/D Valid Indicates A/D value inBytes 102/103 is valid 111 3 RX Power A/D Valid Indicates A/D value inBytes 104/105 is valid 111 2 Reserved Indicates A/D value in Bytes106/107 is valid 111 1 Reserved Indicates A/D value in Bytes 108/109 isvalid 111 0 Reserved Reserved

TABLE 3 DETAIL MEMORY DESCRIPTIONS - ALARM AND WARNING FLAG BITS Alarmand Warning Flag Bits Byte Bit Name Description 112 7 Temp High AlarmSet when internal temperature exceeds high alarm level. 112 6 Temp LowAlarm Set when internal temperature is below low alarm level. 112 5 VccHigh Alarm Set when internal supply voltage exceeds high alarm level.112 4 Vcc Low Alarm Set when internal supply voltage is below low alarmlevel. 112 3 TX Bias High Alarm Set when TX Bias current exceeds highalarm level. 112 2 TX Bias Low Alarm Set when TX Bias current is belowlow alarm level. 112 1 TX Power High Alarm Set when TX output powerexceeds high alarm level. 112 0 TX Power Low Alarm Set when TX outputpower is below low alarm level. 113 7 RX Power High Alarm Set whenReceived Power exceeds high alarm level. 113 6 RX Power Low Alarm Setwhen Received Power is below low alarm level. 113 5-0 Reserved Alarm 114All Reserved 115 All Reserved 116 7 Temp High Warning Set when internaltemperature exceeds high warning level. 116 6 Temp Low Warning Set wheninternal temperature is below low warning level. 116 5 Vcc High WarningSet when internal supply voltage exceeds high warning level. 116 4 VccLow Warning Set when internal supply voltage is below low warning level.116 3 TX Bias High Warning Set when TX Bias current exceeds high warninglevel. 116 2 TX Bias Low Warning Set when TX Bias current is below lowwarning level. 116 1 TX Power High Set when TX output power exceeds highWarning warning level. 116 0 TX Power Low Set when TX output power isbelow low Warning warning level. 117 7 RX Power High Set when ReceivedPower exceeds high Warning warning level. 117 6 RX Power Low Set whenReceived Power is below low Warning warning level. 117 5 ReservedWarning 117 4 Reserved Warning 117 3 Reserved Warning 117 2 ReservedWarning 117 1 Reserved Warning 117 0 Reserved Warning 118 All Reserved119 All Reserved

TABLE 4 Byte Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 X-outcntl0 T alrm hi T alrm lo V alrm hi V alrm lo B alrm hi B alrm lo P alrmhi P alrm lo set set set set set set set set X-out cntl1 R alrm hi Ralrm lo B ft hi set P ft hi set R ft hi set D-in inv D-in set F-in invset set set set X-out cntl2 F-in set L-in inv L-in set Aux inv Aux set Talrm hi T alrm lo V alrm hi set set hib hib hib X-out cntl3 V alrm lo Balrm hi B alrm lo P alrm hi P alrm lo R alrm hi R alrm lo B ft hi hibhib hib hib hib hib hib hib X-out cntl4 P ft hi hib R ft hi hib D-in invD-in hib F-in inv F-in hib L-in inv L-in hib hib hib hib X-out cntl5 Auxinv Aux hib T alrm hi T alrm lo V alrm hi V alrm lo B alrm hi B alrm lohib clr clr clr clr clr clr X-out cntl6 P alrm hi P alrm lo R alrm hi Ralrm lo B ft hi clr P ft hi clr R ft hi clr D-in inv clr clr clr clr clrX-out cntl7 D-in clr F-in inv F-in clr L-in inv L-in clr Aux inv Aux clrEE clr clr clr X-out cntl8 latch invert o-ride data o-ride S reset HIenable LO enable Pullup select select data enable Prescale reservedreserved Reserved reserved B³ B² B¹ B⁰ X-out delay B⁷ B⁶ B⁵ B⁴ B³ B² B¹B⁰ chip address b⁷ b⁶ b⁵ b⁴ b³ b² b¹ X X-ad scale 2¹⁵ 2¹⁴ 2¹³ 2¹² 2¹¹2¹⁰ 2⁹ 2⁸ MSB X-ad scale 2⁷ 2⁶ 2⁵ 2⁴ 2³ 2² 2¹ 2⁰ LSB source/ source/sink D/A #2 range sink D/A #1 range D/A cntl 1/0 2² 2¹ 2⁰ 1/0 2² 2¹ 2⁰config/O- manual manual manual EE Bar SW-POR A/D Manual reserved rideD/A index AD alarm Enable fast alarm Internal D-set D-inhibit D-delayD-clear F-set F-inhibit F-delay F-clear State 1 Internal L-set L-inhibitL-delay L-clear reserved reserved reserved reserved State 0 I/O States 1reserved F-in L-in reserved D-out reserved reserved reserved Margin #1Reserved Neg_Scale2 Neg_Scale1 Neg_Scale0 Reserved Pos_Scale2 Pos_Scale1Pos_Scale0 Margin #2 Reserved Neg_Scale2 Neg_Scale1 Neg_Scale0 ReservedPos_Scale2 Pos_Scale1 Pos_Scale0

1. Circuitry for monitoring an optoelectronic device, comprising: memoryconfigured for storing information related to the optoelectronic device;circuitry configured for: (i) receiving a plurality of analog signalsfrom the optoelectronic device, the analog signals corresponding tocurrent operating conditions of the optoelectronic device including atemperature of the optoelectronic device, transmitter output power,transmitter bias current, and received optical power, (ii) convertingthe received analog signals into digital values, and (iii) storing thedigital values in memory mapped locations within the memory; and atwo-wire serial interface for allowing a host device to read from andwrite to individual memory mapped locations within the memory inaccordance with commands and individual addresses received from the hostdevice, wherein the interface allows the host device to read the digitalvalues corresponding to operating conditions of the optoelectronicdevice from host-specified individual memory mapped locations within thememory.
 2. The circuitry of claim 1, further including: a power supplyvoltage sensor coupled to the analog to digital conversion circuitry,the power supply voltage sensor generating a power level signalcorresponding to a power supply voltage level of the optoelectronicdevice, wherein the analog to digital conversion circuitry is configuredto convert the power level signal into a digital power level value andto store the digital power level value in a power level location withinthe memory; wherein the digital power level is readable via theinterface when the host device specifies to the interface a locationvalue corresponding to the power level location.
 3. The circuitry ofclaim 2, further including: means for comparing the digital power levelvalue with a power level limit value, generating a power level flagvalue based on the comparison of the digital power level value with thepower level limit value, and storing the power level flag value in apower level flag location within the memory; wherein the power levelflag value is readable via the interface when the host device specifiesto the interface a location value corresponding to the power level flaglocation.
 4. The circuitry of claim 1, wherein: the transmitter biascurrent is a laser bias current signal; the analog to digital conversioncircuitry is configured to convert the laser bias current signal into adigital laser bias current value and to store the digital laser biascurrent value in a laser bias current location within the memory; andthe digital laser bias current value is readable via the interface whenthe host device specifies to the interface a location valuecorresponding to the laser bias current location.
 5. The circuitry ofclaim 4, further including: means for comparing the digital laser biascurrent value with a laser bias current limit value, generating a laserbias current flag value based on the comparison of the digital laserbias current value with the laser bias current limit value, and storingthe laser bias current flag value in a laser bias current flag locationwithin the memory; wherein the laser bias current flag value is readablevia the interface when the host device specifies to the interface alocation value corresponding to the laser bias current flag location. 6.The circuitry of claim 1, wherein the transmitter output power is atransmitted laser power signal; the analog to digital conversioncircuitry is configured to convert the transmitted laser power signalinto a digital transmitted laser power value and to store the digitaltransmitted laser power value in a transmitted laser power locationwithin the memory; and the digital transmitted laser power value isreadable via the interface when the host device specifies to theinterface a location value corresponding to the transmitted laser powerlocation.
 7. The circuitry of claim 6, further including: means forcomparing the digital transmitted laser power value with a transmittedlaser power limit value, generating a transmitted laser power flag valuebased on the comparison of the digital transmitted laser power valuewith the transmitted laser power limit value, and storing thetransmitted laser power flag value in a transmitted laser power flaglocation within the memory; wherein the transmitted laser power flagvalue is readable via the interface when the host device specifies tothe interface a location value corresponding to the transmitted laserpower flag location.
 8. The circuitry of claim 1, wherein: the receivedpower analog signal corresponds to received power as measured by aphotodiode detector; the analog to digital conversion circuitry isconfigured to convert the received power analog signal into a digitalreceived power value and to store the digital received power value in areceived power location within the memory; and the digital receivedpower value is readable via the interface when the host device specifiesto the interface a location value corresponding to the received powerlocation.
 9. The circuitry of claim 8, further including: means forcomparing the digital received power value with a received power limitvalue, generating a received power flag value based on the comparison ofthe digital received power value with the received power limit value,and storing the received power flag value in a received power flaglocation within the memory; wherein the received power flag value isreadable via the interface when the host device specifies to theinterface a location value corresponding to the received power flaglocation.
 10. Circuitry for monitoring an optoelectronic device,comprising: memory, for storing information related to theoptoelectronic device; circuitry configured for: (i) receiving aplurality of analog signals from the optoelectronic device, the analogsignals corresponding to current operating conditions of theoptoelectronic device including optoelectronic device temperature, laseroutput power, laser bias current, and received optical power analogsignals, (ii) periodically converting the received analog signals intodigital values, and (iii) periodically storing the digital values inmemory mapped locations within the memory; and a two-wire serialinterface for allowing a host device to read from individual memorymapped locations within the memory in accordance with commands andindividual addresses received from the host device, wherein theinterface allows the host device to read the digital valuescorresponding to operating conditions of the optoelectronic device fromhost-specified individual memory mapped locations within the memory. 11.The circuitry of claim 10, further including: a power supply voltagesensor coupled to the analog to digital conversion circuitry, the powersupply voltage sensor generating a power level signal corresponding to apower supply voltage level of the optoelectronic device, wherein theanalog to digital conversion circuitry is configured to convert thepower level signal into a digital power level value and to store thedigital power level value in a power level location within the memory;wherein the digital power level is readable via the interface when thehost device specifies to the interface a location value corresponding tothe power level location.
 12. The circuitry of claim 11, furtherincluding: means for comparing the digital power level value with apower level limit value, generating a power level flag value based onthe comparison of the digital power level value with the power levellimit value, and storing the power level flag value in a power levelflag location within the memory; wherein the power level flag value isreadable via the interface when the host device specifies to theinterface a location value corresponding to the power level flaglocation.
 13. The circuitry of claim 10, wherein: the analog to digitalconversion circuitry is configured to convert the laser bias currentsignal into a digital laser bias current value and to store the digitallaser bias current value in a laser bias current location within thememory; and the digital laser bias current value is readable via theinterface when the host device specifies to the interface a locationvalue corresponding to the laser bias current location.
 14. Thecircuitry of claim 13, further including: means for comparing thedigital laser bias current value with a laser bias current limit value,generating a laser bias current flag value based on the comparison ofthe digital laser bias current value with the laser bias current limitvalue, and storing the laser bias current flag value in a laser biascurrent flag location within the memory; wherein the laser bias currentflag value is readable via the interface when the host device specifiesto the interface a location value corresponding to the laser biascurrent flag location.
 15. The circuitry of claim 10, wherein theplurality of analog signals comprises a transmitted laser power signal;the analog to digital conversion circuitry is configured to convert thetransmitted laser power signal into a digital transmitted laser powervalue and to store the digital transmitted laser power value in atransmitted laser power location within the memory; and the digitaltransmitted laser power value is readable via the interface when thehost device specifies to the interface a location value corresponding tothe transmitted laser power location.
 16. The circuitry of claim 15,further including: means for comparing the digital transmitted laserpower value with a transmitted laser power limit value, generating atransmitted laser power flag value based on the comparison of thedigital transmitted laser power value with the transmitted laser powerlimit value, and storing the transmitted laser power flag value in atransmitted laser power flag location within the memory; wherein thetransmitted laser power flag value is readable via the interface whenthe host device specifies to the interface a location valuecorresponding to the transmitted laser power flag location.
 17. Thecircuitry of claim 10, wherein: the plurality of analog signalscomprises a received power signal corresponding to received power asmeasured by a photodiode detector; the analog to digital conversioncircuitry is configured to convert the received power signal into adigital received power value and to store the digital received powervalue in a received power location within the memory; and the digitalreceived power value is readable via the interface when the host devicespecifies to the interface a location value corresponding to thereceived power location.
 18. The circuitry of claim 17, furtherincluding: means for comparing the digital received power value with areceived power limit value, generating a received power flag value basedon the comparison of the digital received power value with the receivedpower limit value, and storing the received power flag value in areceived power flag location within the memory; wherein the receivedpower flag value is readable via the interface when the host devicespecifies to the interface a location value corresponding to thereceived power flag location.
 19. The circuitry of claim 10, furthercomprising circuitry for: (i) comparing the digital values withthreshold values to generate flags if the thresholds have been exceeded,and (ii) for storing the flags in predefined memory mapped locations inthe memory, wherein the host is able to read the flags from the memorymapped locations.
 20. The circuitry of claim 19, wherein a certain flagis defined as an end of life indicator.
 21. The circuitry of claim 20,wherein the end of life indicator is a higher than expected bias currentat a constant power.
 22. The circuitry of claim 19, wherein thethreshold values exist for each of the temperature of the optoelectronicdevice, transmitter output power, transmitter bias current, and receivedoptical power.
 23. The circuitry of claim 10, further comprising amemory mapped location in memory for a transmitter disable value. 24.The circuitry of claim 10, further comprising a memory mapped locationin memory for a receiver rate select value.
 25. The circuitry of claim10, further comprising a memory mapped location in memory for atransmitter fault value.
 26. The circuitry of claim 10, furthercomprising a memory mapped location in memory for a loss of signalvalue.